The demand for higher functioning chips at smaller dimensions and operating cool is one of the top challenges in meeting growth by AI, data centers, and EVs.  Companies are driving their substrates to be thinner and supported by carriers.  This isn't new, yet the dicing of multi-layered thin chips present issues as they become thinner. Imagine saw-cutting a piece of paper, lasering through a multi-stack comprising metal and organic without thin film voiding, and finally, conformal protection of bumped wafers having feature variations nearly 50um. These and more are challenges supported by Daetec.