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2015
2010
IEEE/SEMI - 20th ANNUAL ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE - Paper
Eliminating Solvents in Resist Removal Processes Using Low-Cost Detergents
CS MANTECH: 2008 INTERNATIONAL CONFERENCE ON COMPOUND SEMICONDUCTOR MANUFACTURING TECHNOLOGY DIGEST OF PAPERS - Paper 
 
Maximizing Selectivity During Wet-Chemical Gold Etching
2002
PRESENTATION
 
Optimizing Negative-Tone Resist Optimizing Negative-Tone Resist Removal Processes Removal Processes
CS MANTECH: 2002 INTERNATIONAL CONFERENCE ON COMPOUND SEMICONDUCTOR MANUFACTURING TECHNOLOGY DIGEST OF PAPERS - Paper 
 
Through-Substrate Via Etching and Cleaning for High Volume Production Demands
SPIE PROCEEDING 9425 - ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXII (2015) - Paper

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Aqueous-based Thick Photoresist Removal for Bumping Applications
SPIE PROCEEDING 9425 - ADVANCES IN PATTERNING MATERIALS AND PROCESSES XXXII (2015) - Presentation
Aqueous-based Thick Photoresist Removal for Bumping Applications
2015
2002
2010
2008
2008
CS-MAX: 2004 COMPOUND SEMICONDUCTOR MANUFACTURING EXPO TECHNICAL CONFERENCE - Presentation
 
A Novel Approach to Gold Impregnated Polymer Removal Using Solvent Based Chemistry
2004
2004
Contact us

Daetec,

4069 Calle Tesoro, 

Camarillo, CA 93012

United States

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Tel: (805) 484-5546

Fax: (805) 484-5556

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email: jmoore@daetec.com

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