Successes in Temporary Bonding
Wafer Bonding

Sapphire <100um Photonics
Polysilicon 4um (solar)
In 2000, Daetec’s earliest success was the creation of a temporary adhesive for handling thin and fragile wafers. The invention converted an artistic practice to high volume production. Daetec helped create an infrastructure which now supports multiple processes that lead to the development of the most complex devices in the digital age.