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Successes in Temporary Bonding
Successes in Temporary Bonding
Wafer Bonding
Sapphire <100um Photonics
Polysilicon 4um (solar)
Daetec’s earliest success was the creation of a temporary adhesives for handling thin and fragile wafers. We shifted from 25um to <5um wafers and created solutions for peeling large panel substrates for curved TV-sets. From here, we moved into varying carrier substrates that were porous to completely dissolvable.
Aqueous Photoresist REMOVING METHODS
Before Photoresist Removal
After Photoresist Removal
Daetec succeeded in designing popular washing and rinse methods to remove dry-film resists. This allowed the growing wafer business to become automated and faster. Daetec continues to consult and create a broad range of rinsing solutions for the most demanding processes.
Successes in Cleaning
Successes in Cleaning
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