Contact us

Daetec,

4069 Calle Tesoro, 

Camarillo, CA 93012

United States

​​

Tel: (805) 484-5546

Fax: (805) 484-5556

​​

email: jmoore@daetec.com

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Don't hesitate to contact us! 

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2015
IMAPS 2015 - 48TH INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS - Paper 
Substrate Temporary Bonding Supporting Post-Processing Applications
IMAPS 2015 - 48TH INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS - Presentation
Substrate Temporary Bonding Supporting Post-Processing Applications
2014
2013
2012
IEEE - 65TH ELECTRONICS COMPONENT & TECHNOLOGY CONFERENCE (ECTC) -Paper
 
The Use of Temporary Bonding in Manufacturing Flexible and Rigid Substrates
IMAPS 2015 - 11TH INTERNATIONAL CONFERENCE & EXHIBITION ON DEVICE PACKAGING - Presentation
 
Temporary Bonding of Wafers, Displays, and Components
11TH International Wafer Level Packaging Conference (IWLPC) - Paper
 
Thermal Resistant Thin Wafer Support Technology for 3DIC
IMAPS 2014 - 47TH INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS - Paper
High Value Thin Wafer Support Technology for 3DIC
AMERICAN SOCIETY FOR COMPOSITES 29TH TECHNICAL CONFERENCE, 16TH US-JAPAN CONFERENCE ON COMPOSITE MATERIALS, ASTM-D30 MEETING - Paper
Thermal Resistant Polymers for Microelectronic Applications
IMAPS 2014 - 10TH INTERNATIONAL CONFERENCE & EXHIBITION ON DEVICE PACKAGING - Paper
A High Throughput Thin Wafer Support Technology for 3DIC ​
CONFERENCE & EXHIBITION OF THE SOCIETY FOR THE ADVANCEMENT OF MATERIAL & PROCESS ENGINEERING (SAMPE) 2013 - Paper
Thermal Resistant Polymers for Microelectronic Applications
9TH INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC 2012) - PAPER
Optical Profilometry of Substrate Bow Reduction Using Temporary Adhesives
9TH INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC 2012) - PRESENTATION
Multi Sensor 3DIC Metrology
CONFERENCE & EXHIBITION OF THE SOCIETY FOR THE ADVANCEMENT OF MATERIAL & PROCESS ENGINEERING (SAMPE) 2012 - Presentation
Thermal Resistant Coatings Using PBI Resin
IMAPS 2015 - 11TH INTERNATIONAL CONFERENCE & EXHIBITION ON DEVICE PACKAGING - PAPER
 
Temporary Bonding of Wafers, Displays, and Components
IMAPS 2015 - 11TH INTERNATIONAL CONFERENCE & EXHIBITION ON DEVICE PACKAGING - Professional Development Course
Temporary Bonding of Electronic Devices
11TH International Wafer Level Packaging Conference (IWLPC) - Presentation
 
Thermal Resistant Thin Wafer Support Technology for 3DIC
IMAPS 2014 - 47TH INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS - Presentation
High Value Thin Wafer Support Technology for 3DIC
THE SOCIETY FOR INFORMATION DISPLAY 2014 - I-ZONE AT DISPLAY WEEK - Paper
Temporary Bonding of Thin Substrates for Use in Flexible Display Manufacturing
IMAPS 2014 - 10TH INTERNATIONAL CONFERENCE & EXHIBITION ON DEVICE PACKAGING - Presentation
A High Throughput Thin Wafer Support Technology for 3DIC ​
CONFERENCE & EXHIBITION OF THE SOCIETY FOR THE ADVANCEMENT OF MATERIAL & PROCESS ENGINEERING (SAMPE) 2013 - Presentation
Thermal Resistant Polymers for Microelectronic Applications
9TH INTERNATIONAL WAFER LEVEL PACKAGING CONFERENCE (IWLPC 2012) - PRESENTATION
Optical Profilometry of Substrate Bow Reduction Using Temporary Adhesives
CONFERENCE & EXHIBITION OF THE SOCIETY FOR THE ADVANCEMENT OF MATERIAL & PROCESS ENGINEERING (SAMPE) 2012 - Paper
Thermal Resistant Coatings Using PBI Resin
IMAPS 2012 - 8TH INTERNATIONAL CONFERENCE & EXHIBITION ON DEVICE PACKAGING - Paper
Low-Cost Adhesives for Temporary Substrate Support
IMAPS 2012 - 8TH INTERNATIONAL CONFERENCE & EXHIBITION ON DEVICE PACKAGING - Presentation
Low-Cost Adhesives for Temporary Substrate Support
2011
IMAPS 2011 - 44TH INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS - Paper
Extreme Temporary Coatings and Adhesives for High-Thermal, Low-Pressure and Low-Stress 3D-Processing
IMAPS 2011 - ADVANCED TECHNOLOGY WORKSHOP AND TABLETOP EXHIBITION - Presentation
Low-Cost Adhesives for Temporary Substrate Support During Thinning and Backside Processing 
2009
Presentation
Low-Cost Adhesives for Temporary Substrate Support During Thinning and Backside Processing
IEEE - INTERNATIONAL CONFERENCE ON 3D SYSTEM INTEGRATION 2009 - Paper
A Review of Wafer Bonding Materials and Characterizations to enable Wafer Thinning, Backside Processing, and Laser Dicing
2006
CS MANTECH: 2006 INTERNATIONAL CONFERENCE ON COMPOUND SEMICONDUCTOR MANUFACTURING TECHNOLOGY DIGEST OF PAPERS - Paper 
A Chemical and Thermal Resistant Wafer Bonding Adhesive Simplifying Wafer Backside Processing
2004
CS MANTECH: 2004 INTERNATIONAL CONFERENCE ON COMPOUND SEMICONDUCTOR MANUFACTURING TECHNOLOGY - Paper
High Temperature Resistant Adhesive for Wafer Thinning and Backside Processing
2003
ADHESIVES AND SEALANT INDUSTRIES - Article
Adhesives for Optical Components
2002
GaAs MANTECH 2002 - Paper
A New Alternative for Temporary Bonding Wafer Mounting
2001
CS-MAX COMPOUND SEMICONDUCTOR MANUFACTURING EXPO 2001 - Paper
Backside Processing of GaAs Wafers
SEMICON WEST 2001 - INNOVATIONS IN SUBSTRATE TECHNOLOGY - Presentation
Materials and Conditions Used to Optimize Thinning, Processing, and Dismounting of GaAs Wafers
COMPOUND SEMICONDUCTOR MAGAZINE OCTOBER 2001 - Article
Back-side Processing Poses Tough Challenges for GaAs